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Camera Breakout board need PCB layout and very find soldering skills. Cost ~$100
Dennis Pyxida 7 improvement ideas
+ antenna switch (modification already done in pcb layout)
- enables experimental designs of patch antennas, one in the NC and one in the bay itself
- in case of one antenna gets lost (like happened for Hermes2)
+ fix Piezo footprint
- the pins are to close In Rev6 and required bending of the Piezo wires.
+ EMI/RFI shielding
- Reason: we have a harmonics on the same frequency as GPS. If we use a very bad antenna, we get RFI which degrades GPS
- Surface Mount EMI/RFI Shield Clips around all RF parts (unclear if separate for C1200 and C1190)
- requires relocation of programming pins and maybe the
- optional: Shieldings around IMU and Baro
+ Changing SPI flash from WSON8 to SOP8 packaging
- IC is thicker in SOP8
- is simpler to unsolder from PCB
- It showed, that the pins of the SOP8 on the Telemega acted somehow as buffers at impact.
+ Conformal coating
- coat all parts with conformal coating (except for baro)
- protection of the parts against environment (e.g. moilsture, heat of burning lipos, etc)
- keeps all parts hopefully together
+ metal shield on the backside of the pcb with rubber spacers
- protects the backside of the pcb
- acts as additional EMI shielding
+ adding additonal SD card slot similar to LE on the backside of the PCB
- we have a lot of space on the back of the PCB
- SD cards are easy to handle, as proven by LE
+ adding the BT 5.0 module on the back side of the PCB
- can be used for experiments of an internal rocket communication
- potential use in a black box system