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Scribbles for now:

As you check the footprint, fill out the spreadsheet below. Also fill in the tradeoffs spreadsheet.

https://docs.google.com/spreadsheets/d/1AQArIgGLe-hWAkbBj9IDUikQwnTt2Hak--EqBBlPKGo/edit#gid=0

Pads

  • Number of pads

  • Pad order (check the datasheet)

  • Pad size (check the datasheet)

  • Pitch (datasheet)

Paste

  • Click top paste layer and make sure all pads are covered.

  • Check center pad!

Solder Mask

  • Make sure slivers are >0.1mm

    • For this, ensure that the purple parts between the red parts (the pads) are at least 0.1 mm.

Thermal Vias

  • If there’s a big center pad check or other heat sink check that there are vias

  • Check the datasheet 

Overlay/Silk Screen

  • Check there’s an outline (can be just corner indications)

  • Make sure pin 1 is indicated (dot, diagonal works)

  • Width of tracks should be at least 4 mil (0.1 ish mm)

  • Make sure there’s at least 5 mil (0.127mm) between overlay tracks and solder mask. So between yellow and purple

Assembly Drawing (mechanical layer 4)

  • Outline

  • Text

    • Typically have the designator, so U? or J? or something else

    • And have the name of the component, don’t need the whole thing you can just do IMU, CPU, etc.

  • Pin 1

    • Put a dot in the corner

3D Model (mechanical layer 13?)

  • Make sure there’s at least a block

    • Make sure the height is the max height given in datasheet

Courtyard (mech layer 3 i believe)

  • Outline + crosshair

Holes

  • Plating + size

 

To check the schematic:

  • Pins should have the name inside, the number outside the box.

  • To rotate a pin select it and press spacebar

  • Make sure they’re all labeled correctly

  • Default electrical type is passive, but if you’re sure about if it’s VCC, ground, stuff like that (which you can find in the datasheet), indicate its electrical type as input, output, power, i/o, etc.

 

Work in progress...

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