Overview
The Hermes II DAQ is a versatile DAQ (Data Acquisition System) designed for use in Hermes II. It was initially designed to support a variety of instruments in the Hermes II mission package under the payload mission, but it is also meant to serve as a platform for any other data collection efforts. For example, a near duplicate will be used to support extra measurements near the motor section of Hermes II. Please see basic information relating to capabilities and revisions below. For detailed information, including instruction for use, please see Working with the DAQ.
Revision 1
The first iteration was designed on KiCAD 5. The board is compatible with:
- Thermocouples
- High Frequency Vibration Sensors
- Load Cell
Revision 1.IP (Instrumentation Package) is the specific name assigned to the DAQ used for the Hermes II Payload Mission. This version supports all the above, with a 40-pin female connector serving as the interface for 12 thermal sensors (thermocouples and PRTDs) instead of the 12-pin screw terminal block that is seen in Revision 1 and that only supports thermocouples.
Other features common between both of these versions include:
- Built-in SD Card on an independent high speed SDIO bus.
- MK64F processor (120 MHz ARM Cortex-M4)
- Power-on Toggle switch
- M3 mounting pattern.
- 2" by 2.8" dimensions.